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IEC 62258-2-ed.2.0
Semiconductor die products - Part 2: Exchange data formats
STANDARD published on 25.5.2011
The information about the standard:
Designation standards: IEC 62258-2-ed.2.0
Publication date standards: 25.5.2011
SKU: NS-414345
The number of pages: 141
Approximate weight : 454 g (1.00 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62258-2-ed.2.0 :
IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition. This publication is to be read in conjunction with IEC 62258-1:2009. La CEI 62258-2:2011 specifie les formats de donnees qui peuvent etre utilises pour lechange de donnees qui est couvert par dautres parties de la presente serie CEI 62258 ainsi que les definitions de tous les parametres utilises selon les principes et methodes de la CEI 61360. Elle presente un format dechange de donnees de dispositif, DDX (Device Data Exchange), dans le but premier de faciliter le transfert des donnees geometriques adequates entre le fabricant de la puce et lutilisateur de CAO/IAO et des modeles dinformations formels qui permettent lechange de donnees dans dautres formats tels que le format de fichier physique STEP, conformement a ISO 10303-21 et XML. Le format de donnees a ete tenu intentionnellement flexible pour permettre un usage au-dela de ce domaine initial dapplication. Elle a ete developpee pour faciliter la production, la fourniture et lutilisation des produits de puces de semiconducteurs, y compris, sans que cela soit limitatif: les tranches, les puces nues isolees, les puces et tranches avec structures de connexion fixees, les puces et tranches a encapsulation minimale ou partielle. La presente norme reflete le format de donnees DDX en sa version 1.3.0. Par rapport a la premiere edition, plusieurs parametres ont ete mis a jour pour la presente edition. Cette publication doit etre lue conjointement avec la CEI 62258-1:2009.
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