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IEC 62258-5-ed.1.0
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
STANDARD published on 29.8.2006
The information about the standard:
Designation standards: IEC 62258-5-ed.1.0
Publication date standards: 29.8.2006
SKU: NS-414346
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62258-5-ed.1.0 :
IEC 62258-5:2006 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. This publication is to be read in conjunction with IEC 62258-1:2009 and IEC 62258-2:2011. La CEI 62258-5:2006 a ete elaboree afin de faciliter la production, la fourniture et lutilisation des produits de puce de semiconducteurs, comprenant: - les plaquettes; - la puce nue separee; - les puces et les plaquettes avec des structures de connexion fixees; - les puces et les plaquettes a encapsulation minimale ou partielle. La presente partie de la CEI 62258 specifie les informations requises pour faciliter lutilisation des donnees et des modeles de simulation du comportement electrique et la verification de la fonctionnalite correcte des systemes electroniques qui comprennent les puces a semi-conducteurs nues, avec ou sans structures de connexion, et/ou les puces a semi-conducteurs a emballage minimal. Elle est destinee a venir en aide a toutes les personnes impliquees dans la chaine dapprovisionnement des dispositifs de puce afin de se conformer aux exigences de la CEI 62258-1 et de la CEI 62258-2. Cette publication doit etre lue conjointement avec la CEI 62258-1:2009 et la CEI 62258-2:2011.
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