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Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
STANDARD published on 29.9.2010
Designation standards: IEC 62374-1-ed.1.0
Publication date standards: 29.9.2010
SKU: NS-414554
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices. La CEI 62374-1:2010 decrit une methode dessai, une structure dessai et une methode destimation de la duree de vie dun essai de rupture dielectrique en fonction du temps (TDDB) pour des couches intermetalliques appliquees dans des dispositifs a semiconducteurs.
Latest update: 2024-09-11 (Number of items: 2 346 290)
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