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Field Device Integration (FDI®) - Part 1: Overview
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STANDARD published on 4.4.2023
Designation standards: IEC 62769-1-ed.3.0-RLV
Publication date standards: 4.4.2023
SKU: NS-1137812
The number of pages: 91
Approximate weight : 304 g (0.67 lbs)
Country: International technical standard
Category: Technical standards IEC
Industrial process measurement and controlMultilayer applications
IEC 62769-1:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
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Latest update: 2024-09-06 (Number of items: 2 346 102)
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