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Field Device Integration (FDI)® - Part 103-4: PROFINET
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STANDARD published on 18.4.2023
Designation standards: IEC 62769-103-4-ed.3.0-RLV
Publication date standards: 18.4.2023
SKU: NS-1143024
The number of pages: 111
Approximate weight : 364 g (0.80 lbs)
Country: International technical standard
Category: Technical standards IEC
Industrial process measurement and controlMultilayer applications
IEC 62769-103-4:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
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Latest update: 2024-09-06 (Number of items: 2 346 102)
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