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IEC 62769-5-ed.3.0-RLV
Field Device Integration (FDI®) - Part 5: FDI Information Model
Translate name
STANDARD published on 5.4.2023
The information about the standard:
Designation standards: IEC 62769-5-ed.3.0-RLV
Publication date standards: 5.4.2023
SKU: NS-1137820
The number of pages: 219
Approximate weight : 688 g (1.52 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Industrial process measurement and controlMultilayer applications
Annotation of standard text IEC 62769-5-ed.3.0-RLV :
IEC 62769-5:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-5:2023 defines the FDI®[1] Information Model. One of the main tasks of the Information Model is to reflect the topology of the automation system. Therefore, it represents the devices of the automation system as well as the connecting communication networks including their properties, relationships, and the operations that can be performed on them. The types in the AddressSpace of the FDI® Server constitute some kind of catalogue, which is built from FDI® Packages. The fundamental types for the FDI® Information Model are well defined in OPC UA for Devices (IEC 62541-100). The FDI® Information Model specifies extensions for a few special cases and otherwise explains how these types are used and how the contents are built from elements of DevicePackages. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
