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IEC 62878-1-1-ed.1.0
Device embedded substrate - Part 1-1: Generic specification - Test methods
STANDARD published on 20.5.2015
The information about the standard:
Designation standards: IEC 62878-1-1-ed.1.0
Publication date standards: 20.5.2015
SKU: NS-588971
The number of pages: 109
Approximate weight : 358 g (0.79 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62878-1-1-ed.1.0 :
IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components. LIEC 62878-1-1:2015 specifie les methodes dessai pour les substrats avec appareils actifs et passifs integres. Les methodes dessai fondamentales pour les materiaux de substrats de cablage imprime et pour les substrats eux-memes sont specifiees dans lIEC 61189-3. La presente partie de lIEC 62878 est applicable aux substrats avec appareil(s) integre(s) fabriques a partir de materiaux de base organiques, y compris par exemple les appareils actifs ou passifs, les composants discrets formes lors du processus de fabrication dune carte de cablage electronique, ainsi que les composants de feuilles minces.
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