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IEC 62878-1-ed.1.0
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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STANDARD published on 14.10.2019
The information about the standard:
Designation standards: IEC 62878-1-ed.1.0
Publication date standards: 14.10.2019
SKU: NS-974464
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62878-1-ed.1.0 :
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421. LIEC 62878-1:2019 specifie les exigences et methodes d’essai generiques relatives aux substrats avec appareils integres. Les methodes fondamentales dessai pour les materiaux de substrats des cartes imprimees et pour les substrats eux-memes sont specifiees dans lIEC 61189-3. La presente partie de lIEC 62878 est applicable aux substrats avec appareils integres fabriques a partir de materiaux organiques de base, y compris par exemple les appareils actifs ou passifs, les composants discrets formes lors du processus de fabrication des cartes imprimees electroniques, ainsi que les composants de feuilles minces. La serie IEC 62878 ne sapplique ni a la couche de redistribution (RDL – redistribution layer), ni aux modules electroniques definis dans l’IEC 62421.
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