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IEC 62878-2-5-ed.1.0
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
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STANDARD published on 16.9.2019
The information about the standard:
Designation standards: IEC 62878-2-5-ed.1.0
Publication date standards: 16.9.2019
SKU: NS-972774
The number of pages: 53
Approximate weight : 159 g (0.35 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62878-2-5-ed.1.0 :
IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers. IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421. L’IEC 62878-2-5:2019 specifie des exigences fondees sur le schema XML qui represente un format de donnees de conception pour le substrat avec appareil(s) integre(s), c’est-a-dire une carte avec appareil(s) integre(s) actif(s) ou passif(s) dont les connexions electriques se font au moyen d’un trou de liaison, de galvanoplastie, de pate conductrice ou d’impression du materiau conducteur. Ce format de donnees doit etre utilise pour les exigences de simulation (par exemple, contrainte, thermique, compatibilite electromagnetique), d’outillage, de fabrication, d’assemblage et d’examen. De plus, le format de donnees est utilise pour le transfert d’informations entre les concepteurs de cartes imprimees, les ingenieurs de simulation des cartes imprimees, les fabricants et les assembleurs. La presente partie de l’IEC 62878 s’applique aux substrats utilisant des materiaux organiques. Elle ne sapplique ni a la couche de redistribution (RDL, re-distribution layer), ni aux modules electroniques definis comme un modele commercial de type M dans lIEC 62421.
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