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IEC 62899-202-7-ed.1.0
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
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STANDARD published on 3.3.2021
The information about the standard:
Designation standards: IEC 62899-202-7-ed.1.0
Publication date standards: 3.3.2021
SKU: NS-1020015
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62899-202-7-ed.1.0 :
IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
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