Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 62951-5-ed.1.0
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
Translate name
STANDARD published on 27.2.2019
The information about the standard:
Designation standards: IEC 62951-5-ed.1.0
Publication date standards: 27.2.2019
SKU: NS-938049
The number of pages: 33
Approximate weight : 99 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62951-5-ed.1.0 :
IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching. L’IEC 62951-5:2019 specifie la methode d’essai pour les caracteristiques thermiques des materiaux souples. Le present document inclut les termes, definitions, symboles et methodes d’essai pouvant etre utilises pour evaluer et determiner les caracteristiques thermiques des materiaux souples, dans le contexte d’une utilisation pratique. La methode de mesure s’appuie sur la thermometrie optique sans contact, qui est elle-meme basee sur le facteur de reflexion optique, qui depend de la temperature. Le present document s’applique aux semiconducteurs souples en substrat et en couche mince, qui sont soumis a des contraintes de courbure et d’etirement.
