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IEC 63055-ed.2.0
Format for LSI-Package-Board Interoperable design
Translate name
STANDARD published on 11.10.2023
The information about the standard:
Designation standards: IEC 63055-ed.2.0
Publication date standards: 11.10.2023
SKU: NS-1155973
The number of pages: 292
Approximate weight : 907 g (2.00 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Printed circuits and boardsIntegrated circuits. MicroelectronicsLanguages used in information technology
Annotation of standard text IEC 63055-ed.2.0 :
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
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