Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 63215-2-ed.1.0
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Translate name
STANDARD published on 24.10.2023
The information about the standard:
Designation standards: IEC 63215-2-ed.1.0
Publication date standards: 24.10.2023
SKU: NS-1158045
The number of pages: 46
Approximate weight : 138 g (0.30 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 63215-2-ed.1.0 :
IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices. This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index). The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages. NOTE The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup. L’IEC 63215-2:2023 concerne les materiaux de fixation de puce et le systeme d’assemblage appliques aux dispositifs electroniques de puissance de type discret. Le present document specifie le procede d’essai de cycle thermique qui prend en compte les conditions d’usage reelles des dispositifs electroniques de puissance de type discret pour apprecier la fiabilite des materiaux de joint de fixation de puce et du systeme d’assemblage, et elle etablit le niveau de classification concernant la fiabilite des assemblages (indice de performance de fiabilite). La methode d’essai specifiee dans le present document n’a pas pour objectif d’evaluer les dispositifs a semiconducteurs de puissance eux-memes. La methode d’essai specifiee dans le present document n’est pas consideree comme etant celle a utiliser pour garantir la fiabilite des boitiers de dispositifs a semiconducteurs de puissance. NOTE Le resultat d’essai obtenu a l’aide du present document ne sera pas utilise comme des donnees quantitatives absolues, mais comme comparaison entre les resultats des autres materiaux de fixation de puces utilisant le meme montage.
We recommend:
Updating of laws
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
