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IEC 63251-ed.1.0
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
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STANDARD published on 1.11.2023
The information about the standard:
Designation standards: IEC 63251-ed.1.0
Publication date standards: 1.11.2023
SKU: NS-1158046
The number of pages: 42
Approximate weight : 126 g (0.28 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 63251-ed.1.0 :
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress. LIEC 63251:2023 definit les methodes d’essai d’endurance thermique relatives a l’evaluation de la fiabilite des circuits optoelectriques souples. Le present document a pour objet de tenir compte des caracteristiques thermiques uniformes exigees par le circuit optoelectrique souple dans les environnements a haute temperature comme les automobiles. Le present document specifie notamment une methode d’essai pour deceler l’apparition d’un changement de couleur, d’une deformation et d’une destratification des circuits optoelectriques souples sous contrainte thermique.
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