Standard IEC 63522-17-ed.1.0 5.12.2024 preview

IEC 63522-17-ed.1.0

Electrical relays - Tests and measurements - Part 17: Shock, acceleration and vibration

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STANDARD published on 5.12.2024


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The information about the standard:

Designation standards: IEC 63522-17-ed.1.0
Publication date standards: 5.12.2024
SKU: NS-1207681
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Relays

Annotation of standard text IEC 63522-17-ed.1.0 :

IEC 63522-17:2024 is used for testing electromechanical elementary relays (electromechanical relays, reed relays, reed contacts, reed switches and technology combination of these) and for evaluating their ability to perform under expected conditions of transportation, storage and all aspects of operational use. This document defines a standard test method to simulate the mechanical stress on relays as it can occur in service, during handling or during transportation. This document comprises test procedures to simulate shock impacts, steady acceleration environments (such as moving vehicles, aircraft and projectiles) as well as vibration conditions. Le IEC 63522-17:2024 traite des essais des relais electromecaniques elementaires (relais electromecaniques, relais a lames souples, contacts a lames souples et leur combinaisons technologiques) et permet devaluer leur aptitude a fonctionner dans des conditions prevues de transport, de stockage, et tous les aspects dutilisation operationnelle. Le present document definit une methode dessai normalisee qui vise a simuler les contraintes mecaniques exercees sur les relais qui peuvent se produire en service, pendant la manutention ou pendant le transport. Le present document comprend des procedures dessai qui visent a simuler des chocs, des accelerations constantes (dans des vehicules en mouvement, des avions et des projectiles, par exemple) ainsi que des vibrations. Les essais sont generalement prevus pour etre effectues avec des dispositifs soumis a lessai (DUT, Devices Under Test) sans emballage. Toutefois, si lemballage est considere comme une partie essentielle du DUT, les essais definis peuvent egalement etre effectues avec lemballage.

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