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Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
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STANDARD published on 14.10.2022
Designation standards: IEC/TR 60068-3-12-ed.3.0
Publication date standards: 14.10.2022
SKU: NS-1091799
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC TR 60068-3-12:2022(E) which is a Technical Report, describes the creation of temperature-time profiles (in specific envelope profiles) for reflow soldering of electronic assemblies, considering tolerances resulting from the accuracy of the measuring equipment, preparation method and specifications of the manufacturers of components, circuit boards, solder paste, etc.). This edition includes the following significant technical changes with respect to the previous edition:
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