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IEC/TR 60286-7-ed.1.0
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
Translate name
STANDARD published on 14.10.2019
The information about the standard:
Designation standards: IEC/TR 60286-7-ed.1.0
Publication date standards: 14.10.2019
SKU: NS-974415
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Electronic components in generalMechanical structures for electronic equipment
Annotation of standard text IEC/TR 60286-7-ed.1.0 :
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging. L’IEC TR 60286-7:2019 contient des informations sur l’introduction d’un systeme innovant de conditionnement par plaquette thermoformee en volume pour des composants miniaturises, par exemple des composants de type puce d’une taille inferieure ou egale a 1005 (metrique). Elle comprend une proposition de normalisation de l’interface entre les systemes d’emballage et de montage automatique ainsi que les exigences relatives aux proprietes de l’emballage.
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