We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
Translate name
STANDARD published on 20.3.2019
Designation standards: IEC/TR 62878-2-7-ed.1.0
Publication date standards: 20.3.2019
SKU: NS-945084
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
Latest update: 2024-09-04 (Number of items: 2 346 114)
© Copyright 2024 NORMSERVIS s.r.o.