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IEC/TR 62878-2-7-ed.1.0
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
Translate name
STANDARD published on 20.3.2019
The information about the standard:
Designation standards: IEC/TR 62878-2-7-ed.1.0
Publication date standards: 20.3.2019
SKU: NS-945084
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC/TR 62878-2-7-ed.1.0 :
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
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