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IEC/TR 62878-2-9-ed.1.0
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
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STANDARD published on 27.4.2022
The information about the standard:
Designation standards: IEC/TR 62878-2-9-ed.1.0
Publication date standards: 27.4.2022
SKU: NS-1055605
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC/TR 62878-2-9-ed.1.0 :
IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the “concept of Jisso” as well as the “Jisso product level” for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached. Further discussion on “Jisso Product Level” could be needed among the current JIC members to finalize it in the near future based on this technical report.
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