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IEC/TR 63357-ed.1.0
Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
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STANDARD published on 11.10.2022
The information about the standard:
Designation standards: IEC/TR 63357-ed.1.0
Publication date standards: 11.10.2022
SKU: NS-1091998
The number of pages: 14
Approximate weight : 42 g (0.09 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC/TR 63357-ed.1.0 :
IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized. Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.
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