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Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Translate name
STANDARD published on 14.12.2021
Designation standards: IEC/TR 63378-1-ed.1.0
Publication date standards: 14.12.2021
SKU: NS-1045527
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
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Latest update: 2025-03-13 (Number of items: 2 232 199)
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