We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
Translate name
STANDARD published on 10.4.2018
Designation standards: IEC/TS 62647-4-ed.1.0
Publication date standards: 10.4.2018
SKU: NS-845674
The number of pages: 41
Approximate weight : 123 g (0.27 lbs)
Country: International technical standard
Category: Technical standards IEC
Production. Production managementElectronic components in generalAerospace electric equipment and systems
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
Latest update: 2024-09-08 (Number of items: 2 346 217)
© Copyright 2024 NORMSERVIS s.r.o.