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IEC/TS 62878-2-3-ed.1.0
Device embedded substrate - Part 2-3: Guidelines - Design guide
STANDARD published on 27.3.2015
The information about the standard:
Designation standards: IEC/TS 62878-2-3-ed.1.0
Publication date standards: 27.3.2015
SKU: NS-583706
The number of pages: 50
Approximate weight : 150 g (0.33 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC/TS 62878-2-3-ed.1.0 :
IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components. LIEC TS 62878-2-3:2015 decrit le guide de conception des substrats avec appareil(s) integre(s). Le guide de conception du substrat avec appareil(s) integre(s) est essentiellement identique a celui de differentes cartes de circuits electroniques. La presente partie de lIEC 62878 permet une comprehension approfondie de la conception du circuit, de la conception de la structure, de la conception de la carte, de la fabrication de la carte, de jisso (processus dassemblage) et des essais des produits. Il est applicable aux substrats avec appareil(s) integre(s) fabriques a partir de materiaux de base organiques, y compris par exemple les appareils actifs ou passifs, les composants discrets formes lors du processus de fabrication dune carte de cablage electronique, ainsi que les composants de feuilles minces.
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