Standard IEEE 1730.1-2023 21.2.2024 preview

IEEE 1730.1-2023

IEEE Recommended Practice for Distributed Simulation Engineering and Execution Process Multi-Architecture Overlay

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STANDARD published on 21.2.2024


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The information about the standard:

Designation standards: IEEE 1730.1-2023
Publication date standards: 21.2.2024
SKU: NS-1168251
The number of pages: 95
Approximate weight : 316 g (0.70 lbs)
Country: International technical standard
Category: Technical standards IEEE

Annotation of standard text IEEE 1730.1-2023 :

Revision Standard - Active.
A recommended practice for applying the Distributed Simulation Engineering and Execution Process (DSEEP) to the development and execution of distributed simulation environments that include more than one distributed simulation architecture is described. The distributed simulation architectures to which the recommended practice applies include Distributed Interactive Simulation (DIS), High Level Architecture (HLA), and Test and Training Enabling Architecture (TENA). The DSEEP Multi-Architecture Overlay (DMAO) identifies and describes multi-architecture issues and provides recommended actions for simulation environment developers faced with those issues. The DMAO also augments the DSEEP lists of inputs, recommended tasks, and outcomes with additional inputs, recommended tasks, and outcomes that apply to multi-architecture simulation environments. This document is an overlay to the DSEEP, which is a separate recommended practice.

ISBN: 979-8-8557-0479-2, 979-8-8557-0480-8
Number of Pages: 95
Product Code: STD26746, STDPD26746
Keywords: DIS, Distributed Interactive Simulation, distributed simulation, Distributed Simulation Engineering and Execution Process, DMAO, DSEEP, High Level Architecture, HLA, IEEE 1730™, IEEE 1730.1™, multi-architecture, systems engineering methodology, TENA, Test and Training Enabling Architecture
Category: Simulation Interoperability

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