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ISO/TS 10303-1650:2018-ed.5.0
Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die
Translate name
STANDARD published on 18.12.2018
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The information about the standard:
Designation standards: ISO/TS 10303-1650:2018-ed.5.0
Publication date standards: 18.12.2018
SKU: NS-943498
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO
The category - similar standards:
Annotation of standard text ISO/TS 10303-1650:2018-ed.5.0 :
Description / Abstract: ISO/TS 10303-1650:2018-11 specifies the application module for Bare die. The following is within the scope of ISO/TS 10303-1650:2018-11: The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package. definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.
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