We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
Translate name
STANDARD published on 18.12.2018
Availability | IN STOCK |
Price | ON REQUEST excl. VAT |
ON REQUEST |
Designation standards: ISO/TS 10303-1689:2018-ed.5.0
Publication date standards: 18.12.2018
SKU: NS-943536
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO
Description / Abstract: ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation. The following are within the scope of ISO/TS 10303-1689:2018-11: thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
Latest update: 2024-09-08 (Number of items: 2 346 217)
© Copyright 2024 NORMSERVIS s.r.o.