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ISO/TS 10303-1754:2010-ed.2.0
Industrial automation systems and integration — Product data representation and exchange — Part 1754: Application module: Via component
Translate name
STANDARD published on 18.5.2010
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The information about the standard:
Designation standards: ISO/TS 10303-1754:2010-ed.2.0
Publication date standards: 18.5.2010
SKU: NS-943599
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO
The category - similar standards:
Annotation of standard text ISO/TS 10303-1754:2010-ed.2.0 :
Description / Abstract: ISO/TS 10303-1754:2010-03 specifies the application module for Via component. The following are within the scope of ISO/TS 10303-1754:2010-03: blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed; cylinder vias, where the cross-section shape is constant; tapered vias, where the cross-section shape may vary as the vertical distance changes; stacked vias, where multiple bind and buried vias share the same x y position; filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698; buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed; interfacial connections, also known as through hole vias, which have both ends exposed; items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684; items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
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