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Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
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STANDARD published on 20.6.2003
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Designation standards: JIS Z3198-4:2003
Publication date standards: 20.6.2003
SKU: NS-1083292
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: Japanese technical standard
Category: Technical standards JIS
This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.History:2003-06-20 Established 2008-10-01 Confirmed 2013-10-21 Confirmed 2018-10-22 Confirmed 2023-10-20 Confirmed
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Latest update: 2024-09-08 (Number of items: 2 346 102)
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