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Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead
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STANDARD published on 20.6.2003
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Designation standards: JIS Z3198-6:2003
Publication date standards: 20.6.2003
SKU: NS-1083294
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: Japanese technical standard
Category: Technical standards JIS
This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.History:2003-06-20 Established 2008-10-01 Confirmed 2013-10-21 Confirmed 2018-10-22 Confirmed 2023-10-20 Confirmed
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