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Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components
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STANDARD published on 20.6.2003
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Designation standards: JIS Z3198-7:2003
Publication date standards: 20.6.2003
SKU: NS-1083295
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: Japanese technical standard
Category: Technical standards JIS
This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.History:2003-06-20 Established 2008-10-01 Confirmed 2013-10-21 Confirmed 2018-10-22 Confirmed 2023-10-20 Confirmed
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