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Standard JIS Z3285:2017 20.12.2017 preview

JIS Z3285:2017

Solder paste for micro-joining -- Characteristic test methods for solder paste using fine particles

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STANDARD published on 20.12.2017


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The information about the standard:

Designation standards: JIS Z3285:2017
Publication date standards: 20.12.2017
SKU: NS-1083334
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: Japanese technical standard
Category: Technical standards JIS

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Brazing and soldering

Annotation of standard text JIS Z3285:2017 :

This Standard specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1, mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 micrometre or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices.History:2017-12-20 Established 2022-10-20 Confirmed

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