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Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
STANDARD published on 1.1.2006
Designation standards: ASTM F584-06
Note: WITHDRAWN
Publication date standards: 1.1.2006
SKU: NS-55780
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
bonding wire, inspection, lead-bonding wire, semiconductor packaging, visual inspection, wire, ICS Number Code 29.060.10 (Wires)
1. Scope | ||||||||
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. 1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope. 1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality. 1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use. |
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2. Referenced Documents | ||||||||
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