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ČSN EN 60191-6-18 (358791)
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
STANDARD published on 1.10.2010
The information about the standard:
Designation standards: ČSN EN 60191-6-18
Classification mark: 358791
Catalog number: 86879
Publication date standards: 1.10.2010
SKU: NS-155834
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
Electrical and electronics engineering drawingsSemiconductor devices in generalMechanical structures for electronic equipment
Annotation of standard text ČSN EN 60191-6-18 (358791):
Tato norma poskytuje společné výkresy a rozměry pro všechny typy pouzder s vývody v provedení jako pole kulových vývodů (BGA). Rozteč mezi vývody je jeden milimetr nebo více. Tvar pouzdra je čtvercový
Preview of the standard ČSN EN 60191-6-18 (358791)
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