We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)
STANDARD published on 1.6.2011
Designation standards: ČSN EN 60191-6-21
Classification mark: 358791
Catalog number: 88328
Publication date standards: 1.6.2011
SKU: NS-155839
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
1.9.2001
1.7.2010
1.3.2012
1.10.2010
1.6.2011
1.9.2013
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
Latest update: 2024-11-22 (Number of items: 2 206 568)
© Copyright 2024 NORMSERVIS s.r.o.