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ČSN EN 60191-6-22 (358791)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
STANDARD published on 1.9.2013
The information about the standard:
Designation standards: ČSN EN 60191-6-22
Classification mark: 358791
Catalog number: 93689
Publication date standards: 1.9.2013
SKU: NS-155840
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
Electrical and electronics engineering drawingsSemiconductor devices in generalMechanical structures for electronic equipment
Annotation of standard text ČSN EN 60191-6-22 (358791):
Tato norma poskytuje normované výkresy s rozměry, které jsou společné pouzdřeným strukturám s křemíkovým čipem pro pouzdra s polem kuličkových vývodů (BGA) a pouzdra s plošným polem vývodů (LGA)
Preview of the standard ČSN EN 60191-6-22 (358791)
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