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ČSN EN 62047-9:2012/Oprava1 (358775)
Polovodičové součástky - Mikroelektromechanické součástky - Část 9: Měření pevnosti spojení dvou destiček pro MEMS. (Norma přebírající anglický originál, vlastní text je součástí výtisku).
Automatically translated name:
Semiconductor devices - Microelectromechanical devices - Part 9 : Measurement of bond strength of two wafers for MEMS. ( In English , the text is part of a copy ).
STANDARD published on 1.8.2012
The information about the standard:
Designation standards: ČSN EN 62047-9:2012/Oprava1
Classification mark: 358775
Catalog number: 91245
Note: Correction
Publication date standards: 1.8.2012
SKU: NS-161592
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
This change (correction) applies to this standard:
ČSN EN 62047-9 (358775)
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Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Standard published on 1.3.2012
Selected format: English (the title page in Czech only) - Print design (14.50 USD)
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