We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA).
STANDARD published on 1.8.2010
Designation standards: DIN EN 60191-6-18:2010-08
Publication date standards: 1.8.2010
SKU: NS-236836
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA).
1.12.2011
WITHDRAWN
1.8.2013
1.9.2011
1.9.2002
1.3.2011
1.3.2011
Latest update: 2025-01-09 (Number of items: 2 218 396)
© Copyright 2025 NORMSERVIS s.r.o.