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Standard DIN EN 60191-6-19:2010-10 1.10.2010 preview

DIN EN 60191-6-19:2010-10

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage.



STANDARD published on 1.10.2010


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The information about the standard:

Designation standards: DIN EN 60191-6-19:2010-10
Publication date standards: 1.10.2010
SKU: NS-236837
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN

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The category - similar standards:

Mechanical structures for electronic equipment

Annotation of standard text DIN EN 60191-6-19:2010-10 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung.

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DIN EN 60191-6-3:2001-06DIN EN 60191-6-3:200..

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E DIN IEC 60191-6-5:2010-01E DIN IEC 60191-6-5:..

WITHDRAWN
1.1.2010

Latest update: 2025-04-17 (Number of items: 2 197 070)
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