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IEC 60191-6-18-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
STANDARD published on 7.1.2010
The information about the standard:
Designation standards: IEC 60191-6-18-ed.1.0
Publication date standards: 7.1.2010
SKU: NS-409107
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-18-ed.1.0 :
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy. La CEI 60191-6-18:2010 fournit des dessins dencombrement, des dimensions et des variations recommandees normalises pour tous les boitiers matriciels a billes de forme carree (BGA), dont le pas de sortie est superieur ou egal a 1 mm. La presente norme annule et remplace lIEC/PAS 60191-6-18 publie en 2008. Cette premiere edition constitue une revision technique. Le contenu des corrigenda de mai 2010 et juillet 2010 a ete pris en consideration dans cet exemplaire.
These corrections apply to this standard:
IEC 60191-6-18-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
(Corrigendum 1 - Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-18: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs pour montage en surface - Guide de conception pour les boitiers matriciels a billes (BGA))
Correction published on 31.5.2010
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IEC 60191-6-18-ed.1.0/Cor.2
Correction
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Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
(Corrigendum 2 - Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-18: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs pour montage en surface - Guide de conception pour les boitiers matriciels a billes (BGA))
Correction published on 28.7.2010
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