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Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
STANDARD published on 31.5.2010
Designation standards: IEC 60191-6-18-ed.1.0/Cor.1
Note: Correction
Publication date standards: 31.5.2010
SKU: NS-409105
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-18: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs pour montage en surface - Guide de conception pour les boitiers matriciels a billes (BGA))
Standard published on 7.1.2010
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