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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
STANDARD published on 8.3.2012
Designation standards: IEC 62047-9-ed.1.0/Cor.1
Note: Correction
Publication date standards: 8.3.2012
SKU: NS-414116
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
(Dispositifs a semiconducteurs - Dispositif microelectromecaniques - Partie 9: Mesure de la resistance de collage de deux plaquettes pour les MEMS)
Standard published on 13.7.2011
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