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IEC 60191-4-ed.3.0
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
STANDARD published on 10.10.2013
The information about the standard:
Designation standards: IEC 60191-4-ed.3.0
Publication date standards: 10.10.2013
SKU: NS-409097
The number of pages: 48
Approximate weight : 144 g (0.32 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-4-ed.3.0 :
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use. La CEI 60191-4:2013 specifie une methode pour la designation des structures des boitiers et pour la classification des formes des structures de boitiers des dispositifs a semiconducteurs, ainsi quune methode generale pour etablir des codes de designation descriptifs universels pour les boitiers a semiconducteurs. Le code de designation descriptif fournit un outil de communication utile mais nintegre pas de controle permettant dassurer linterchangeabilite des boitiers. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) Un materiau designe par le code "S" est ajoute pour indiquer un boitier a base de silicium. b) La description de "WL" qui est ajoutee est destinee a un usage general.
These changes apply to this standard:
IEC 60191-4-ed.3.0/Amd.1
Change
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Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
(Amendement 1 - Normalisation mecanique des dispositifs a semiconducteurs - Partie 4: Systeme de codification et classification en formes des structures des boitiers pour dispositifs a semiconducteurs)
Change published on 27.3.2018
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