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IEC 62047-2-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
STANDARD published on 15.8.2006
The information about the standard:
Designation standards: IEC 62047-2-ed.1.0
Publication date standards: 15.8.2006
SKU: NS-414105
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-2-ed.1.0 :
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features. Cette norme internationale specifie la methode pour les essais de traction des materiaux en couche mince d fune longueur et d fune largeur inferieure a 1 mm et d fune epaisseur inferieure a 10 Em, qui sont des materiaux structurels principaux pour les systemes microelectromecaniques (MEMS), micromachines et dispositifs analogues. Les materiaux structurels principaux pour les MEMS, les micromachines et autres dispositifs analogues comportent des caracteristiques speciales telles que des dimensions typiques de l fordre de quelques microns, une fabrication de materiau par depot, et une fabrication d feprouvettes d fessai par usinage non mecanique au moyen de la gravure et de la photolithographie. Cette norme internationale specifie la methode d fessai qui garantit une precision correspondant aux caracteristiques speciales.
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