We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
STANDARD published on 1.12.2010
Designation standards: ČSN EN 60191-6-19
Classification mark: 358791
Catalog number: 87285
Publication date standards: 1.12.2010
SKU: NS-155835
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
Tato norma určuje měřicí metody pro měření zprohýbání pouzdra při zvýšené teplotě a maximální dovolený průhyb pro pouzdra BGA, FBGA a FLGA
1.1.2004
1.6.2002
1.2.2002
1.6.2002
1.7.2004
1.3.2012
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
Latest update: 2024-07-01 (Number of items: 2 329 690)
© Copyright 2024 NORMSERVIS s.r.o.