Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
ČSN EN 60191-6-19 (358791)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
STANDARD published on 1.12.2010
The information about the standard:
Designation standards: ČSN EN 60191-6-19
Classification mark: 358791
Catalog number: 87285
Publication date standards: 1.12.2010
SKU: NS-155835
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
Annotation of standard text ČSN EN 60191-6-19 (358791):
Tato norma určuje měřicí metody pro měření zprohýbání pouzdra při zvýšené teplotě a maximální dovolený průhyb pro pouzdra BGA, FBGA a FLGA
Preview of the standard ČSN EN 60191-6-19 (358791)
Similar standards:
1.1.2004
1.6.2002
1.2.2002
1.6.2002
1.7.2004
1.3.2012
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
