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IEC 60191-6-5-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
STANDARD published on 27.8.2001
The information about the standard:
Designation standards: IEC 60191-6-5-ed.1.0
Publication date standards: 27.8.2001
SKU: NS-409116
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-5-ed.1.0 :
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
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