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IEC 62047-12-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
STANDARD published on 13.9.2011
The information about the standard:
Designation standards: IEC 62047-12-ed.1.0
Publication date standards: 13.9.2011
SKU: NS-414100
The number of pages: 59
Approximate weight : 177 g (0.39 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-12-ed.1.0 :
IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 µm to 1 000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration. La CEI 62047-12:2011 specifie une methode dessai de fatigue en flexion utilisant les vibrations a la resonance des structures mecaniques a tres petite echelle des systemes microelectromecaniques (MEMS), et des micromachines. La presente norme sapplique aux structures vibrantes dont la taille est dans la gamme allant de 10 µm a 1 000 µm dans le plan et de 1 µm a 100 µm depaisseur, ainsi qua des materiaux dessai mesurant moins de 1 mm de longueur, moins de 1 mm de largeur et entre 0,1 µm et 10 µm depaisseur. Les materiaux de construction principaux pour les systemes microelectromecaniques, les micromachines, etc., comportent des caracteristiques speciales telles que des dimensions typiques de lordre de quelques microns, la fabrication des materiaux par depot et la fabrication deprouvettes dessai par usinage non mecanique, par exemple la photolithographie. Les structures a systemes micro-electromecaniques presentent souvent une frequence de resonance fondamentale et une resistance superieures a celles des macro-structures. Pour evaluer et garantir la duree de vie des structures a systemes microelectromecaniques, on doit etablir une methode dessai de fatigue avec des cycles de charge tres eleves (jusqua 1012). Le but de la methode dessai est devaluer les proprietes de fatigue mecanique des materiaux a tres petite echelle sur une courte duree en appliquant une contrainte de flexion a charge elevee et a haute frequence cyclique en utilisant des vibrations a la resonance.
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